Oehrlein, Gottlieb S.
Ph.D., State University of New York–Albany, 1981
Applications of low-temperature plasma science and technology to materials processing, surface chemistry and physics of thin film growth, etching and modification, plasma-surface and plasma-polymer interactions, in-situ plasma and surface diagnostics, physics and chemistry of ion-induced surface processes and of imaging and templating materials, nanoscale structure and device fabrication and characterization, surface and bulk defects of materials.
Prior to joining the A. James Clark School of Engineering at the University of Maryland in 2000, Professor Oehrlein was a member of the Department of Physics faculty at the State University of New York–Albany from 1993 to 2000, and a research staff member in IBM's Division of Research at the T.J. Watson Research Center, in Yorktown Heights, NY.
Honors and Awards
- 2010 IBM Faculty Award
- 2005 Plasma Prize, Plasma Science and Technology Division, American Vacuum Society
- 2003 Invention of the Year Finalist for Method and Device for Nanoscale Plasma Processing of Materials (US Patent #7470329), UMD Office of Technology Commercialization
- 2002 IBM Faculty Award
- Fellow, International Union of Pure and Applied Chemistry (2000)
- Fellow, American Vacuum Society (1998)
- Thinker Award of Tegal Corporation, SEMICON West (1993)
- Electronics Division Award of the Electrochemical Society (1992)
- Six IBM Invention Plateau Awards (1982-1993)
- IBM Outstanding Technical Achievement Award (1989)
- Solid State Science and Technology Young Author's Award of the Electrochemical Society (1985)
- State University of New York Chancellor's Honors Convocation Award for Academic Excellence and a Distinguished Dissertation (1982)
- Fellow, Institute of International Education, New York (1980)
- Presidential Fellow, State University of New York, Albany (1978-1981)
Books and Chapters
G. S. Oehrlein, T.E.F.M. Standaert, P. J. Matsuo, Chapter 9, Plasma etching of low dielectric constant materials, Spring Series in Advanced Microelectronics, Vol. 9, "Low Dielectric Constant Materials for IC Applications" (Springer, Heidelberg, 2002).
G. S. Oehrlein, K. Maex, Y.-C. Joo, S. Ogawa, and J. T. Wetzel, editors, Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectric, MRS Symposium Proceedings Volume 612 (Warrendale, 2001).
For a complete list of publications, please visit Professor Oehlein's web site
"Characterization and Mechanism of He Plasma Pretreatment of Nanoscale Polymer masks for Improved Pattern Transfer Fidelity," F. Weilnboeck, D. Metzler, N. Kumar, G. S. Oehrlein, R. L. Bruce, S. Engelmann, and N. Fuller, Appl. Phys. Letts. 99, 261501 (2011) (doi: 10.1063/1.3671995).
"Plasma-Polymer Interactions: A Review of Progress in Understanding Polymer Resist Mask Durab ility during Plasma Etching for Nanoscale Fabrication," G. S. Oehrlein, R. J. Phaneuf, and D. B. Graves, J. Vac. Sci. Technol. B 29 , 010801 (2011). (doi: 10.1116/1.3532949)
"Poly (2-vinyl naphthalene-b-acrylic acid) Block Copolymer Pattern Formation, Alignment and Pattern Transfer into Silicon by Reactive Ion Etching," Xin Zhang, Christopher Metting, R. M. Briber, Florian Weilnboeck, Sang Hak Shin, Ben Jones, and Gottlieb S. Oehrlein, Macromolecular Chemistry and Physics 212, 1735-1741 (2011). (doi: 10.1002/macp.201100232)
"On the Absence of Post-Plasma Etch Surface and Line Edge Roughness in Vinylpyridine Resists," R. L. Bruce, F. Weilnboeck, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson, and A. Alizadeh, J. Vac. Sci. Technol. B 19, 041604 (2011). (doi: 10.1116/1.3607604)
"Ion and Vacuum Ultraviolet Photon Beam Effects in 193 nm Photoresist Surface Roughening: The Role of the Adamantyl Pendant Group," T. Y. Chung, D. B. Graves, F. Weilnboeck, R. L. Bruce, G. S. Oehrlein, M. Q. Li, and E. A. Hudson, Plasma Processes and Polymers 8, 1068-1079 (2011). (doi: 10.1002/ppap.201100071)
"Hydrogenation and Surface Density Changes in Hydrocarbon Films during Erosion Using Ar/H2Plasmas," N. Fox-Lyon, G. S. Oehrlein, N. Ning, D. B. Graves, J. Appl. Phys. 110, 104314 (2011). (doi: 10.1063/1.3662953)
"Molecular Structure Effects on Dry Etching Behavior of Si-containing Resists in Oxygen Plasma," R. L. Bruce, T. Lin, R. J. Phaneuf, G. S. Oehrlein, W. Bell, B. Long, and C. G. Willson, J. Vac. Sci. Technol. B 28 , 751 (2010). (doi: 10.1116/1.3455496)
"Role of Polymer Structure and Ceiling Temperature in Polymer Roughening and Degradation during Plasma Processing: A Beam System Study of P4MS and P alpha MS," D. Nest, T. Y. Chung, J. J. Vegh, D. B. Graves, R. L. Bruce, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, and C. G. Willson, J. Phys. D - Appl. Phys. 43, 085204 (2010). (doi: 10.1088/0022-3727/43/8/085204)
"Relationship between Nanoscale Roughness and Ion-Damaged Layer in Argon Plasma Exposed Polystyrene Films," R. L. Bruce, F. Weilnboeck, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long, C. G. Willson, J. J. Vegh, D. Next and D. B. Graves, J. Appl. Phys. 107, 084310 (2010). (doi: 10.1063/1.3373587)
"Electron, Ion and Vacuum Ultraviolet Photon Effects in 193 nm Photoresist Surface Roughening," T. Y. Chung, D. Nest, D. B. Graves, F. Weilnboeck, R. L. Bruce, G. S. Oehrlein, D. Wang, M. Li, and E. A. Hudson, J. Phys. D - Appl. Phys. 43 , 272001 (2010). (doi: 10.1088/0022-3727/43/27/272001 )
"Photoresist Modifications by Plasma Vacuum Ultraviolet Radiation: The Role of Polymer Structure and Plasma Chemistry," F. Weilnboeck, R. L. Bruce, S. Engelmann, G. S. Oehrlein, D. Nest, T.-Y. Chung, D. Graves, M. Li, D. Wang, C. Andes, and E. A. Hudson, J. Vac. Sci. Technol. B 28 , 993 (2010). (doi: 10.1116/1.3484249)
"Real-Time and Post-Plasma Studies of Influence of Low Levels of Tungsten on Carbon Erosion and Surface Evolution Behaviour in D2 Plasma," F. Weilnboeck, N. Fox-Lyon, G. S. Oehrlein, and R. P. Doerner, Nucl. Fusion 50, 025027 (2010). (doi: 10.1088/0029-5515/50/2/025027)
"Surface and Near-Surface Modifications of Ultralow Dielectric Constant Materials Exposed to Plasmas under Sidewall-Like Conditions," Ming-Shu Kuo and G. S. Oehrlein, J. Vac. Sci. & Technol. B 28 , (2010). (doi: 10.1116/1.3499271)
"Mechanistic Study of Ultralow K-Compatible Carbon Dioxide in situ Photoresist Ashing Processes. I. Process Performance and Influence on ULK Material Modification," Ming-Shu Kuo, A. R. Pal, G. S. Oehrlein, P. Lazzeri, and M. Anderle, J. Vac. Sci. & Technol. B 28 , (2010). (doi: 10.1116/1.3482343)
"Mechanistic Study of Ultralow k-Compatible Carbon Dioxide in Situ Photoresist Ashing Processes. II. Interaction with Preceding Fluorocarbon Plasma Ultralow k Etching Processes," Ming-Shu Kuo, A. R. Pal, and G. S. Oehrlein, J. Vac. Sci. Technol. B 28 , 961 (2010). (doi: 10.1116/1.3482353)
"Influence of C4F8/Ar Based Etch and H2 Based Remote Ash Processes on ULK Materials Modifications," M.-S. Kuo, X. Hua, G. S. Oehrlein, A. Ali, P. Jiang, P. Lazzeri, and M. Anderle, J. Vac. Sci. Technol. B 28 , 284 (2010). (doi:10.1116/1.3308623)
"Stages in the Interaction of Deuterium Atoms with Amorphous Hydrogenated Carbon Films: Isotope Exchange, Soft-Layer Formation, and Steady-State Erosion," G. S. Oehrlein, T. Schwarz-Selinger, K. Schmid, M. Schlüter, and W. Jacob, J. Appl. Phys. 108, 043307 (2010). (doi:10.1063/1.3474988)
"Plasma-Surface Interactions of Advanced Photoresists with C4F8/Ar Discharges: Plasma Parameter Dependencies," S. Engelmann, R. L. Bruce, M. Sumiya, T. Kwon, R. Phaneuf, G. S. Oehrlein, C. Andes, D. Graves, D. Nest, and E. A. Hudson, J. Vac. Sci. & Technol. B 27 , 92 (2009). (doi: 10.1116/1.3054342)
"Real-Time Studies of Surface Roughness Development and Reticulation Mechanisms of Advanced Photoresist Materials during Plasma Processing," A. R. Pal, R. L. Bruce, F. Weilnboeck, S. Engelmann, T. Lin, M.-S. Kuo, R. Phaneuf, and G. S. Oehrlein, J. Appl. Phys. 105, 031133 (2009). (doi: 10.1063/1.3055268 )
"Low-Temperature Plasma-Assisted Nanotransfer Printing between Thermoplastic Polymers," D. Y. Lee, D. R. Hines, C. M. Stafford, C. L. Soles, E. K. Lin, and G. S. Oehrlein, Adv. Mater. 21, 1 (2009). (doi: 10.1002/adma.200803121)