Come join the elite MSE program at the University of Maryland!

Materials Science and Engineering (MSE) at Maryland is a diverse field that bolsters other branches of engineering. The development of safe, high-density batteries, cars with better gas mileage, ultra high density magnetic hard drives for future computers, advanced solar cells and many other technological breakthroughs require innovative materials and processes to build on what is available today. MSE is the field that spearheads these discovery and development processes.

• Combine Engineering with Chemistry and Physics
• Find jobs in microelectronics, automotive, biotech, venture capital start-ups, government labs and more
• Excellent starting salaries for graduates
• Get research experience as an undergraduate
• Small classes allow you to get to know your professors

Fall 2026 Events (Registration Required for All)

• In-Person Departmental Open House: Please join the Materials Science and Engineering Department for an in-person information session. The session will include an overview of our major, lab tours, and a Q&A panel with current students. Speak with faculty and staff within the department who will be able to answer your questions.
  • Saturday, October 10, 2026 10 a.m. - 12:30 p.m. (EST)
  • Location: Jeong H. Kim Engineering Building Room 1110
  • Follow link to register.
• Virtual Q&A with current MSE Students: Speak with current students as they discuss research, student experiences inside and outside the classroom, and bring your questions.
  • Wednesday, October 21, 2026 6:30 p.m. - 7:30 p.m. (EST)
  • Virtual (Zoom link will be provided one week prior to the event)
  • Follow link to register.
• Undergraduate Admissions Events: **Events are being organized by the University.
  • Follow link to register.

Questions? Send an email to: mseundergrad@umd.edu

Meet Student Researcher Yianni Bonincontri '28

During my time as a research assistant at the Center for Advanced Life Cycle Engineering (CALCE), I worked in electronic packaging fabrication, characterization, and failure analysis. The work involved making test samples, in which I prepared alumina substrates in and out of the UMD Fab Lab and performed die attach using tin-silver transient liquid phase sintering.  Through this characterization, I evaluated voiding behavior and intermetallic compound growth. I tracked variables such as plasma etcher operational settings and substrate surface roughness. This experience provided me with an understanding of electronics manufacturing, material characterization, and packaging reliability testing.