The Microelectronics Devices Laboratory specializes in failures analysis and related methodology for integrated circuits and packages. It has the capability to meet these challenges and successfully perform the failure analysis of the integrated circuit (IC) packages with the state-of-the-art analytical techniques. Both destructive and nondestructive failure analysis of IC packages can be performed. Significant experimental capability toward this goal is achieved through cooperation with the Nanoscale Imaging and Spectroscopy Lab (NISP).
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